Summary

Funded by: European Union
From: 01/05/2020 until: 30/04/2023
Main Researchers: Fernández Caballero, Antonio

Abstract

Electronic components and systems are key enablers for various applications affecting our daily life areas. Moreover, they are the innovation drivers for the development of technologies, products and systems. This development is enabled and based on the results of improved reliability. Reliability is enhanced by manufacturing excellence, advanced reliability testing methods and robustness validation to verify the quality and reliability requirements needed in different application domains. Hence, to understand physical failures and defect dynamics is of utmost importance for enhancing reliability and has to be considered along the whole value chain from chip, package to board to system. Reliability has a significant impact on the entire ECS industry and all its applications. Consequently, all ECS value chain partners – material suppliers, chip manufacturers, board and system integrators, Tier I and Tier II as well as OEMs are focusing on improving reliability to satisfy the end customer. The project iRel4.0 influences various aspects of the MASP – Transport and Smart Mobility, Digital Industry, education and healthcare systems, communication, energy sector, production as well as sales and marketing.